SoC Power and Thermal Modeling Engineer

Responsibilities

• Develop and maintain product-level power and thermal models that project real behaviour from component-level inputs.
• Model power delivery network behaviour, supply droop, di/dt, leakage and thermal limits, and translate them into what the design can sustain rather than what it can peak at.
• Set and hold TDP envelopes, typical and peak operating points, and all-core sustained frequency targets.
• Run workload-driven power analysis using representative benchmarks and workload traces.
• Produce sensitivity studies that show which architectural levers actually move power, and by how much.
• Correlate projections against measured silicon as it becomes available, and feed the error back into model fidelity.
• Supply power numbers to architecture trade-off studies on a timescale that lets them influence the outcome.
• Build the tooling, assumptions and documentation so the models are usable by people who did not write them.

Qualifications & Skills

• Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
• 5+ years in power modelling, power and thermal analysis, or a closely related discipline.
• Working understanding of power and thermal fundamentals — dynamic and leakage power, supply droop, di/dt, thermal limits — sufficient to reason about them as model inputs.
• Demonstrated experience building models from component-level data and defending the results.
• Proficiency in Python for modelling, data analysis and automation.
• Clear written communication; these models are used by people who need to understand their limits.

Preferred Qualifications & Skills

• SoC or CPU power estimation methodology, especially pre-silicon to post-silicon correlation.
• RTL-based power analysis and physical-design power convergence.
• Power delivery network modelling and voltage regulator behaviour.
• Working knowledge of DVFS, adaptive voltage scaling, and voltage-frequency curve modelling.
• Thermal modelling, including package-level thermal behaviour.
• High-performance or server-class CPU experience; RISC-V a plus.
• Familiarity with advanced TSMC nodes and power scaling across node transitions.

What We Offer

• Own the power and thermal envelope every product projection is built on
• Competitive compensation & benefits package
• Collaboration with talented engineers passionate about cutting-edge CPU technologies.
• Opportunities for professional growth in an innovative, fast-paced environment
• A flexible and inclusive work culture